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PTFE在覆铜板中的应用 被引量：8

Application of PTFE in copper clad laminate
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摘要 介绍了PTFE树脂的特性及其在覆铜板中的应用,阐述了PTFE覆铜板的主要种类,最后介绍国内PTFE覆铜板发展现状。 This paper introduces the properties of Poly tetra fluor oethylene（PTFE） and the application of PTFE in copper clad laminate（CCL） and describes the main structure of PTFE CCLs. In the end, it provides comments about the status of domestic PTFE CCL.
作者 江恩伟 杨中强
机构地区 广东生益科技股份有限公司
出处 《印制电路信息》 2013年第3期14-17,共4页 Printed Circuit Information
关键词 聚四氟乙烯 覆铜板 高频 无机填料 Poly Tetra Fluoro Ethylene Copper Clad Laminate High Frequency Inorganic Filler
分类号 TN41 [电子电信—微电子学与固体电子学]
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参考文献7

二级参考文献22

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共引文献23

同被引文献41

  • 1祝大同.高速、高频PCB用基板材料评价与选择[J].印制电路信息,2003,11(8):14-19. 被引量：17
  • 2郝拉娣,于化东.正交试验设计表的使用分析[J].编辑学报,2005,17(5):334-335. 被引量：93
  • 3Fraga. Printed circuit boards: A review on Ihe perspective of sustainability [ J ]. Join'hal of Environmental Manage- ment, 2013, 131 ( 1 ) : 298 -306.
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  • 8Li Y Y, Xu C X, Li H, et al. Nonenzymatic r for detection of carbohydrate antigen 15 - 3 based on hierar- chical nanoporous PtFe alloy [ J ]. Biosensors and Bioelec- tronics, 2014, 56( 1 ) :295 -299.
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  • 10喻宗根,辜信实.高频覆铜板的开发[J].印制电路信息,2010,18(3):22-24. 被引量：2

引证文献8

二级引证文献13

印制电路信息
2013年 第3期

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