摘要
基于JEDEC标准,采用ABAQUS软件建立了具有5个POP封装组件的三维有限元模型,通过试验验证了模型的准确性,讨论了PCB板阻尼、焊点形状、焊点材料及焊点直径对该封装组件在跌落冲击过程中动态响应的影响.结果表明:POP封装组件关键焊点的最大法向拉应力随PCB阻尼和焊点直径的增大而减小;截顶球形焊点最大法向拉应力都大于柱形焊点的最大法向拉应力;无铅焊料焊点最大拉应力大于锡铅焊料焊点最大拉应力,而对于无铅焊料,角焊点最大拉应力随着含锡量的增加而减小.
Based on JESD22-B111 standard, a three-dimensional finite element model was established for PCB assembly with five POP packages by ABAQUS software, and the validity of the model was verified by test date from free drop testing. The effects of the PCB damping, the shape of solder joint, the material of solder joint and the diameter of solder joint on the drop impact performance were researched in this paper. The results showed that the maximum normal tensile stress at the critical solder joints for POP assembly decreased as the PCB damping and the diameter of solder joint increased; the maximum normal stress of the truncated spherical solder joints was greater than that of cylindrical solder joints; the maximum normal stress of free-lead solder joints was larger than that of the lead solder joints, and with the increase of content of tin, the maximum stress for the critical solders decreased.
出处
《中国科学：物理学、力学、天文学》
CSCD
北大核心
2013年第3期289-296,共8页
Scientia Sinica Physica,Mechanica & Astronomica
基金
国家自然科学基金资助项目(批准号:11172045)
国家重点基础研究发展计划(编号:2010CB832706)资助项目
