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Ultra-low specific on-resistance vertical double-diffused metal-oxide semiconductor with a high-k dielectric-filled extended trench 被引量:1

Ultra-low specific on-resistance vertical double-diffused metal-oxide semiconductor with a high-k dielectric-filled extended trench
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摘要 An ultra-low specific on-resistance trench gate vertical double-diffused metal-oxide semiconductor with a high-k dielectric-filled extended trench(HK TG VDMOS) is proposed in this paper.The HK TG VDMOS features a high-k(HK) trench below the trench gate.Firstly,the extended HK trench not only causes an assistant depletion of the n-drift region,but also optimizes the electric field,which therefore reduces Ron,sp and increases the breakdown voltage(BV).Secondly,the extended HK trench weakens the sensitivity of BV to the n-drift doping concentration.Thirdly,compared with the superjunction(SJ) vertical double-diffused metal-oxide semiconductor(VDMOS),the new device is simplified in fabrication by etching and filling the extended trench.The HK TG VDMOS with BV = 172 V and Ron,sp = 0.85 mΩ·cm2 is obtained by simulation;its Ron,sp is reduced by 67% and 40% and its BV is increased by about 15% and 5%,in comparison with those of the conventional trench gate VDMOS(TG VDMOS) and conventional superjunction trench gate VDMOS(SJ TG CDMOS). An ultra-low specific on-resistance trench gate vertical double-diffused metal-oxide semiconductor with a high-k dielectric-filled extended trench(HK TG VDMOS) is proposed in this paper.The HK TG VDMOS features a high-k(HK) trench below the trench gate.Firstly,the extended HK trench not only causes an assistant depletion of the n-drift region,but also optimizes the electric field,which therefore reduces Ron,sp and increases the breakdown voltage(BV).Secondly,the extended HK trench weakens the sensitivity of BV to the n-drift doping concentration.Thirdly,compared with the superjunction(SJ) vertical double-diffused metal-oxide semiconductor(VDMOS),the new device is simplified in fabrication by etching and filling the extended trench.The HK TG VDMOS with BV = 172 V and Ron,sp = 0.85 mΩ·cm2 is obtained by simulation;its Ron,sp is reduced by 67% and 40% and its BV is increased by about 15% and 5%,in comparison with those of the conventional trench gate VDMOS(TG VDMOS) and conventional superjunction trench gate VDMOS(SJ TG CDMOS).
出处 《Chinese Physics B》 SCIE EI CAS CSCD 2013年第2期439-444,共6页 中国物理B(英文版)
基金 Project supported by the National Natural Science Foundation of China (Grant Nos. 60806025 and 61176069 ) the Program for New Century Excellent Talents in University of Ministry of Education of China (Grant No. NCET-11-0062)
关键词 high permittivity specific on-resistance breakdown voltage trench gate high permittivity,specific on-resistance,breakdown voltage,trench gate
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  • 1Chen J, Sun W F, Zhang L, Zhu J and Lin Y Z 2012 IETE Tech, Rev. 2944.
  • 2Ren M, Li Z H, Deng G M, Zhang L X, Zhang M, Liu X L, Xie J X and Zhang B 2012 Chin. Phys. B 21 048502.
  • 3BaJiga B J 1996 Power Semiconductor Devices (Boston, MA: PWS) 373.
  • 4Coe D J US 1988 US Patent: 4754310 [1988-06-28].
  • 5Chen X B and Sin J K 0 2001 IEEE Trans. Electron. Dev. 48344.
  • 6Gan K P, Liang Y C, Samudra G S, Xu S M and Liu Y 2001 IEEE 32nd Annual Power Electronics Specialists Conference. June 17-21, 2001, Vancouver, BC 4 2156.
  • 7Liang Y C, Gan K P and Samudra G S 2001 IEEE Electron. Dev. Lett. 22407.
  • 8Duan B X, Yang Y T, Zhang Band Li Z J 2011 Micro & Nano Lett. 6 777.
  • 9Wang Y, Lan H, Cao F, Liu Y T and Shao L 2012 Chin. Phys. B 21 068503.
  • 10Onishi Y, Iwamoto S, Sato T, Nagaoka T, Ueno K and Fujihira T 2002 ISPSD. pp. 241-244.

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