摘要
含硅芳炔树脂是一种新型的耐高温热固性树脂,具有优异的耐热性能、优良的介电性能、高温力学性能和优异的工艺性能,广泛应用于航空航天、电子信息领域。本文用热失重方法(TGA)研究了含硅芳炔树脂的热氧化降解动力学。结果显示含硅芳炔树脂的热氧化降解过程分为三个阶段,热氧化增重阶段、热氧化降解阶段Ⅰ、热氧化降解阶段Ⅱ。采用Ozawa和Kissinger方法分析了含硅芳炔树脂热氧化降解的三个阶段的活化能、反应级数、频率因子等动力学参数。
Silicon-arylacetylene-containing resin （PSA-R） offers excellent high-temperature resistance, low dielectric constant, high-temperature mechanical property and easy processability. The kinetics of the thermal oxidative degradati der air. The on of silicon-arylacetylene-containing resin was investigated by thermogravimetric analysis （TGA） unthermal oxidative degradation of PSA-R had three different processes ： thermal oxidation of unsaturated chain, thermal oxidative degradation of end-, side-chain scission and main-chain. The corresponding kinetic parameters include activation energy, pre-exponential factor and empirical order of the thermal oxidative degradation stages were evaluated by using Ozawa and Kissinger metnods, respectively.
出处
《玻璃钢／复合材料》
CAS
CSCD
北大核心
2013年第2期34-38,12,共6页
Fiber Reinforced Plastics/Composites
基金
国家自然科学基金(90816021)
关键词
含硅芳炔树脂
热氧化
降解动力学
silicon-containing arylacetylene resin
thermal oxidative
kinetics
