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十六烷基三甲基溴化铵对硫酸盐电镀镍的影响 被引量:4

Influence of Cetyltrimethylammonium Bromide on Sulfate Nickel Plating
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摘要 研究了阳离子型表面活性剂十六烷基三甲基溴化铵(CTAB)对硫酸盐镀镍层的硬度、内应力、表面形貌、孔隙率及电解液的电流效率、分散能力、阴极极化、电化学反应阻抗的影响,并采用X射线衍射仪(XRD)表征了镀镍层的微观结构。结果表明:CTAB的加入能显著细化镀镍层的晶粒尺寸,提高镀镍层的硬度和拉应力;随着CTAB的质量浓度的增加,镀镍层的孔隙率减小,而电解液的电流效率、分散能力变化不大;在电解液中添加CTAB,使阴极极化作用略有减弱,且镍沉积阻抗减小;镀镍层呈现(200)晶面择优取向,且随着CTAB的质量浓度的增加,镀层(200)晶面的相对取向密度增大。 The influence of cationic surfactant cetyltrimethylammonium bromide (CTAB) was investigated on the hardness, internal stress, surface morphology and porosity of the nickel deposit from sulfate electrolyte as well as the cathodic current efficiency, throwing power, cathodic polarization, electrochemical reaction impedance of the electrolyte. The microstructure of the nickel deposit was characterized by X-ray diffraction (XRD) test. The results show that addition of CTAB can notably fine the grain size of nickel deposit and improve the hardness and internal stress of nickel deposit. With the increase of CTAB concentration, the porosity of nickel deposit is reduced but the cathodic current efficiency and throwing power of the plating solution almost remain. Adding CTAB to the electrolyte can slightly decrease the cathodic polarization and electrochemical reaction impedance of nickel deposition. X-ray diffraction analysis suggests that (200) plane is the crystallographic preferential orientation of the nickel deposit and the relative texture coefficient increases with the increase of CTAB concentration.
出处 《电镀与环保》 CAS CSCD 北大核心 2013年第2期19-23,共5页 Electroplating & Pollution Control
基金 广西自然科学基金(桂科自0991247) 广西教育厅基金(No.201010LX174)
关键词 电镀镍 硫酸盐 十六烷基三甲基溴化铵 硬度 孔隙率 nickel deposit sulfate CTAB hardness porosity
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参考文献12

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