摘要
有机硅封装材料具有较好的绝缘性能、耐候性能、耐紫外线性能及较高的透光率和折射率等,其固化时应力较小,不易发生黄变,可有效延长LED的使用寿命,是较为理想的LED封装材料。综述了有机硅改性环氧树脂类封装材料和有机硅类封装材料的研究进展,并展望了其未来的研究方向。
Silicone materials possess attributes of superior insulation, weather and UV resistance, showing high transmittance, high refractive index and yellow resistance, which make it suitable for encapsulation of LED. The research progress of silicone modified epoxy resin encapsulating materials and silicone packaging materials is reviewed, and the future research direction of silicone materials is prospected.
出处
《包装学报》
2013年第2期10-14,共5页
Packaging Journal
