摘要
介绍了一种S波段小型化集成功放模块的设计方法。该模块采用GaAs和硅功率芯片,通过内匹配混合集成电路技术,将两级芯片集成到金属密封管壳中。实测结果表明,在脉宽200μs,占空比10%的测试条件下,3.1～3.4GHz全带内功率放大器输出功率能达到60W,36V电源效率大于35%,模块尺寸仅为26.5mm×15.0mm×5.0mm。
A research of S-band miniature integrated PA is reported by using GaAs and Si power chips. Two power chips are welded in a metal package by internal matching and mix inte- grated circuit. Measured results show the developed device can deliver 60 W output power over a 3.1~3.4 GHz band at 200 tLs pulse width, 10% duty cycle, 36 V operating voltage, with more than 35% drain efficiency. The module＇s size is only 26.5mm×15.0mm×5.0mm.
出处
《固体电子学研究与进展》
CAS
CSCD
北大核心
2013年第2期141-143,182,共4页
Research & Progress of SSE
关键词
小型化
高增益
混合集成电路
功率放大器
miniature size
high gain
mix integrate circuit
power amplifier（PA）
