期刊文献+

雷达刷丝导电环钯镍合金镀膜技术研究 被引量:1

Radar Brush Wire Conductive Ring Palladium Nickel Alloy Coating Technology Research
下载PDF
导出
摘要 描述了针对雷达刷丝-导电环采用钯镍合金镀膜的技术,对铝青铜材质的导电环刷丝面进行电镀,达到耐磨性钯镍合金膜层结构,以满足产品所需要的耐磨和导电要求。研究了钯镍合金溶液的钯离子浓度参数变化,以及参数变化对刷丝面镀层钯镍百分比含量的影响。结合镀金层对实验结果进行分析,讨论了各种现象出现的原因。 Palladium nickel alloy technique is adopted for the radar brush wire conductive ring. Metallization is conducted on aluminum bronze material of conductive ring to wear resistance palladium nickel alloy membrance layer structure, so as to meet the wear-resisting and conductive requirements. The palladium ion concentration parameter change in the palladium nickel alloy solution and its influence on brush w.ire surface thickness is studied. Combined with the experiment results of gold plated layer, the article analyzes the reasons of various phenomena.
作者 吴晓霞
出处 《电子科技》 2013年第5期154-155,159,共3页 Electronic Science and Technology
关键词 钯镍合金 镀金 电阻率变化值 palladium nickel alloy gold-plated resistivity change value
  • 相关文献

参考文献4

  • 1ABYS J A, KUDRAK E J, MAISANO J J, et al. The electro-deposition and material propertiesof palladium2Nickel alloys [J]. Metal Finishing,1991,89(7) :43 -52.
  • 2GRAKAM A H, BIEGUNSKI M J, UPDEGRAFF S W. Evalu- tion of Pal2 ladium substitutes for Gold [ J]. Plating and Sur- face Finishing, 1983,70(110) :52 -57.
  • 3郭艳丽,王艳芳,郭超,牛超.钯镍合金镀层特性研究[J].新技术新工艺,2011(7):90-91. 被引量:6
  • 4苑娟,肖耀坤,余刚,叶立元.低速电沉积钯镍合金工艺的研究[J].电镀与环保,2004,24(6):14-17. 被引量:7

二级参考文献14

  • 1Sehlesing M. Modern eleetroplating[M]. Warrendale, TMS-AIME Publication, 2006.
  • 2Abys JA. The electrodeposition and material properties of palladium-nickel alloys [J]. Metal Finishing, 1991, 89 ( 7 ) : 231-234.
  • 3岳俊培,杨防祖,田中群,等.不同镍含量钯镍合金电镀及性质表征[A].中国化学会第27届学术年会,2010.
  • 4李凤凌,姚士冰.电镀高镍的钯镍合金研究[A].中国电子学会电镀专业委员会第七届电镀年会,1998.
  • 5李风凌,姚士冰,周绍民.钯-镍合金电镀的研究进展[D].厦门:厦门大学,2000.
  • 6Abys J A, et al. The Electrodeposition and Material Properties of Palladium-Nickel Alloys[J]. Metal Finishing, 1991, 89(7):43-52.
  • 7Grakam A H, Biegunski M J, Updegraff S W. Evalution of Palladium Substitutes for Gold[J]. Plating and Surface Finishing, 1983, 70(110):52-57.
  • 8Martin J L, Toben M P. Palladium and Palladium Alloy Electrodeposits in the Electronics Industry[J]. Metal Finishing, 1990, 88(1):39-41.
  • 9Favier F, Walter E C, Zach M P, Benter T, Penner R M. Hydrogen Sensors and Switches from Electrodeposited Palladium Mesowire Arrays[J]. Science, 2001, 293(5338):2227-2231.
  • 10Scharnagl K, Eriksson M, Karthigeyan A, Burgmair M, Zimmer M, Eisele I. Hydrogen Detection at High Concentrations with Stabilized Palladium[J]. Sensors and Actuators B, 2001, 78:138-143.

共引文献8

同被引文献11

引证文献1

二级引证文献1

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部