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3D NoC的冗余双向TSV容错设计 被引量：5

Fault-tolerant design of redundant bidirectional TSV on 3D NoC
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摘要 3D NoC(Network-on-Chip)中,若连接层间相邻路由器的两组单向TSV(Through-Silicon Via)中有1组故障,数据便不能经该通道传输。为实现容错,提出一种在基于簇的3D NoC中添加冗余双向TSV的设计。任何1组单向TSV故障,都可通过配置这组双向TSV来替换,实现容错。在无故障TSV时,也可配置这组双向TSV来帮助传输数据包,实现数据的高速传输。与参考文献相比,实验表明,有TSV故障时该设计的平均延时至少减少了43.8%,且提高了系统可靠性。 On the 3 D NoC （ Network-on-Chip）, if one of the two groups of unidirectional TSVs （ Through-Silicon Vias） in the adjacent routers between the layers has fault, the data would not be transmitted through this channel. A Fault-tolerant design of a cluster-based 3D NoC added redundant bidirectional TSVs is presented. A group of extra bidirectional TSVs, which could be dynamically configured between the unidirectional TSVs, was added to replace either of them which is faulted. What＇s more, in the trouble-free case, the bidirectional TSVs could be configured to help transmit data packets to achieve high-speed data transmission. The experimental results demonstrate that the average packet transmission latency decreases by 43.8% at lest compared with the reference when some TSVs are fault, and the reliability of the system is improved.
作者 欧阳一鸣 袁吴铃 梁华国 谢涛 黄正峰
机构地区 合肥工业大学计算机与信息学院 合肥工业大学电子科学与应用物理学院 Department of Computer Science
出处 《电子测量与仪器学报》 CSCD 2013年第4期326-333,共8页 Journal of Electronic Measurement and Instrumentation
基金 国家自然科学基金(61274036 61106038) 安徽高校省级自然科学研究重点(KJ2010A269) 安徽省科技攻关(11010202190)资助项目
关键词 3D NOC 容错 冗余 双向TSV 3DNoC fault tolerant redundant bidirectional TSV
分类号 TP302 [自动化与计算机技术—计算机系统结构]
  • 相关文献

参考文献18

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二级参考文献40

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共引文献11

同被引文献64

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引证文献5

二级引证文献54

电子测量与仪器学报
2013年 第4期

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