摘要
在接入网中,低成本、小尺寸的同轴结构封装10 Gb/s光接收组件起着非常重要的作用。在微波频段,封装器件引入的寄生参数已经成为制约其高频特性的主要因素之一。基于传输线理论,建立了包含芯片、金丝、管座的小信号等效电路模型。等效电路元件与实际封装器件有对应的关系。组件高频特性随元件参数值变化而变化。仿真结果表明金丝对其高频特性影响很严重。为了减小金丝电感,提出一种优化方案。并结合实际工艺条件,制作了样品,实验结果表明该样品的传输速率达到10 Gb/s,满足10 Gb/s光网络传输的要求。
A 10 Gb/s receiver optical sub-assembly with transistor outline package plays an important role in the access network due to the attractive characteristics of low cost and small size. Its high-frequency characteristics are limited by the parasitic parameters of the packaging devices at microwave frequency bands. Based on the transmission line theory, a small signal equivalent circuit model including the chip, bonding wire and header were established. The elements of the equivalent circuit correspond to the practical packaging devices. The high-frequency characteristics of the receiver optical sub-assembly vary with the values of the elements. The simulation results show that the bonding wire becomes a serious effect on the high-frequency characteristics. In order to reduce the inductance of the bonding wire, an optimal solution was proposed. In considering a practical situation, a prototype was fabricated. The measurement result shows that the data rate is up to 10 Gb/s. Therefore, the proposed receiver optical sub-assembly can meet the requirements for the 10 Gb/s optical network transmission.
出处
《半导体技术》
CAS
CSCD
北大核心
2013年第5期383-387,共5页
Semiconductor Technology
关键词
同轴结构封装
10Gb
s光接收组件
寄生参数
小信号等效电路模型
高频特性
transistor outline package
10 Gb/s receiver optical sub-assembly
parasitic parameter
small signal equivalent circuit model
high-frequency characteristics
