期刊文献+

LED筒灯散热仿真及光源布局优化研究 被引量:14

Heat Dissipation Modeling Research of LED Downlight and Light Source Layout Optimization
下载PDF
导出
摘要 为了更好地解决LED筒灯散热问题,利用CFD热仿真软件建立LED筒灯散热模型。考虑了的材料导热率设置、热阻计算、辐射率设定、热载荷形式等影响灯具散热因素,然后用数值分析模拟和实验室测试相结合的方法,综合分析灯具散热情况。在此基础上,着重研究LED颗数及LED间距对光源散热的影响,在仿真分析的基础上对现有LED筒灯光源布局进行优化。经过实验测量验证,光源布局优化后的LED工作温度更为理想,能有效提高LED灯具的寿命,对LED筒灯的开发设计具有重要的实践意义。 In order to solve the heat dissipation software is used to establish LED downlight d problem of LED 1SS1 model. downlight, CFD thermal simulation After the consideration of thermal conductivity of materials, thermal resistance, thermal radiation coefficient, heat load forms and other factors, the numerical simulation and combined laboratory test is used to analysis the lamp's heat dissipation. Based on this analysis, the paper is focused on the dissipation effect with the LED numbers and the mutual distance. Then LED chips layout of current LED downlight is optimized. Experiment verifies the LED working temperature is much low after optimization and it may improve the LED lamp lifetime effectively. The method may also be used in the future LED downlight design.
作者 陈杰
出处 《照明工程学报》 2013年第3期81-86,共6页 China Illuminating Engineering Journal
基金 国家科技支撑计划项目(2011BAE01B10) 863计划项目(2011AA03A109)
关键词 照明 LED筒灯 散热 建模 仿真 lighting LED Downlight heat dissipation modeling simulationz
  • 相关文献

参考文献9

  • 1Arik M, Beckerb C, Weaverb S, et al. Thermalmanagement of LEDs: Package to system [ J ]. ProcSPIE,2004, 5 (187) : 64 -75.
  • 2Zirong Lin, Shuangfeng Wang, Jiepeng Huo, et al. Heattransfer characteristics and LED heat sink application ofaluminum plate oscillating heat pipes [ J ]. AppliedThermal Engineering 2011 (31): 2221 -2229.
  • 3Xiang Jinahua, Zhang Chunliang, Jiang Fan, et al.Fabrication and testing of phase change heat sink for highpower LED [ J ]. Transactions of Nonferrous MetalsSociety of Chang, 2011 (21 ) : 2066 -2071.
  • 4Ming-Te Lin, Shang-Ping Ying, Ming-Yao Lin, et al.High power LED package with vertical structure [ J ].Microelectronics Reliability, 2012 (52): 878 - 883.
  • 5白坤,吴礼刚,聂秋华,戴世勋,周伯友,马湘君.大功率LED筒灯散热封装设计与分析[J].光学技术,2012,38(3):300-304. 被引量:2
  • 6马湘君,吴礼刚,戴世勋,李继亮,周伯友,白坤,郑兆勇.大功率LED筒灯散热分析[J].照明工程学报,2011,22(6):18-21. 被引量:15
  • 7Weng Chunjen. Advanced thermal enhancement andmanagement of LED packages [ J ]. InternationalCommunications in Heat and Mass Transfer, 2009, 36(3): 245 -248.
  • 8Xiang Jianhua,Ye Bangyan, Tang Yong, Zhou Wei, etal. Forming technology of boiling structure on evaporationsurface of phase-change heat sink for high-power lightemitting diode [ J] . Journal of Central South University ofTechnology, 2010, 17 (3) : 544 -548.
  • 9Hsueh-han Wu, Kuan-kong Lin, Shun-Tian Lin. A studyon the heat dissipation of high power multi-chip COB LEDs[J]. Microelectronics Journal, 2012 (43): 280 - 287.

二级参考文献20

  • 1吴慧颖,钱可元,胡飞,罗毅.倒装大功率白光LED热场分析与测试[J].光电子.激光,2005,16(5):511-514. 被引量:49
  • 2钱可元,郑代顺,罗毅.GaN基功率型LED芯片散热性能测试与分析[J].半导体光电,2006,27(3):236-239. 被引量:51
  • 3Jianzheng Hu, Lianqiao Yang, and Moo Whan Shin. Thermal and mechanical analysis of high-power LEDs with ceramic packages [ J 1. IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2008, 8 (2): 297-303.
  • 4Lianqiao Yang, Jianzheng Hu, Sunho Jang, et al. Thermal design of ceramic, packages for high power light-emitting diodes [J]. Semicond. Sci. Technol, 2007, 22:705 - 708.
  • 5Lianqiao Yang, Sunho Jang, Woongjoon Hwang, et al. Thermal analysis of high. power GaN-based LEDs with ceramic package [ J]. Thermochimica acta, 2007, 455: 95 - 99.
  • 6H.K. Ma, B.R. Chen, H.W. Lan, et al. Study of an LED device with a honeycomb heat sink [ C ]. 26^th IEEE SEMI-THERM Symposium, 2010:289 - 298.
  • 7M. Y. Tsai, C. H. Chen, and C. S. Kang, Thermal ansyses and measurements of low-cost COP package for high-power LED [ C ]. 2008 Electronic components and technology conference, 2008 : 1812 - 1818.
  • 8周波,刘胜.大功率白光LED封装技术研究[D].武汉:华中科技大学,2007.
  • 9Steigerwald D A,Bhat J C,Collins D.Illumination with solidstate lighting technology[J].IEEE Journal Selected Topics inQuantum Electron,2002,8(2):310—320.
  • 10Narendran N,Gu Y.Life of LED-based white light sources[J].Display Technology,2005,1(1):167—171.

共引文献15

同被引文献109

引证文献14

二级引证文献23

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部