摘要
拾片头是倒装芯片键合机的关键运动部件之一,需要实现X、Y、Z三个方向的往复快速移动。模态分析是研究拾片头振动特性的基础。利用Pro/E建立拾片头三维模型,保存为.x_t格式后导入ANSYS Workbench12进行计算模态分析,获取拾片头的前10阶固有频率和振型,并对计算结果进行了分析。结果表明:拾片头一阶固有频率为1 455 Hz,远高于拾片头的工作频率,不会产生共振现象,具有较好的动力学特性。
Picking chip head is one of the most important moving parts of flip chip bonder. It needs to implement reciprocating fast moving of X YZthree directions. Modal analysis is foundation of the study of picking chip head vibration characteristic. 3D model of picking chip head is established with Pro/E. The model is saved in the format of. x_t, and modal analysis is made after importing the model into ANSYS Workbench. The first ten order inherent frequencies and vibration mode of picking chip head are obtained. The calculation results are analyzed. The results show that picking chip head＇ s first-order inherent frequency is 1 455 Hz. It is higher than work frequency of picking chip head. The resonance phenomenon would not occur. Picking chip head has better dynamic characteristic.
出处
《机床与液压》
北大核心
2013年第12期83-88,共6页
Machine Tool & Hydraulics
基金
Shandong Province Natural Science Foundation,China(ZR2011EEM014)
