摘要
本文采用转盘电极阳极溶出法测定了光亮酸性镀铜液中组合添加剂的最佳整平浓度,又用赫尔槽测定了最大光亮区浓度,结果与通常生产中的用量相符。添加剂对铜沉积过程的阻化效应随镀液中添加剂浓度的增大而增大。如果用转盘电极在极限电流的电位处,阴极沉积一定的时间,随后使沉积的铜薄层阳极溶解,此时阳极溶出电量 Q 阳与镀液中添加剂的浓度 C_添成线性关系,因此可用来定量测定镀液中添加剂的浓度。
The optimum concentration of additive SC-1 for levelling in acid copper plating bath is de- termined by anodic dissolving of deposits on the rotating disk electrode.The optimum concentra- tion of SC-1 for widest bright range is also tested with Hull cell.The results are in accordance with that used in production.The inhibitive effect of SC-1 on copper electrodeposition increases with the increase of additive concentration in the bath.Tests show that,if a film of Cu is cath- odically deposited under limit current at controlled potential for a definit time and then dissolved at the anode,the electricity consumed in anode dissolution has a linear relation to the concentration of the additive.Thus it can be used to quantitatively determine the concentra- tion of SC-1 in acid Cu plating bath.(p.24-26)
出处
《电镀与环保》
CAS
CSCD
1991年第1期24-26,共3页
Electroplating & Pollution Control
