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电子束固化复合材料及界面 被引量:3

Electron beam curing fiber reinforced composites and their interfaces
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摘要 综述了电子束固化工艺相对于传统热固化工艺的特点 ,并从以下几方面介绍电子束固化技术的一些进展 :自由基电子束固化聚合物基体、阳离子电子束固化聚合物基体、电子束固化复合材料界面特点和改性方法 ,并对电子束固化树脂基复合材料中存在的问题进行评述 . Presents the curing process in polymer matrix composites by electron beam and the status of electron beam curable radical polymeric systems, and electron beam curable cationic polymeric systems, the interface of electron beam cured composites and methods to improve the interlaminar shear strength of electron beam cured composites.
出处 《材料科学与工艺》 EI CAS CSCD 2000年第3期97-102,共6页 Materials Science and Technology
基金 国家自然科学基金!重点资助项目 (5 9833110 )
关键词 电子束固化复合材料 界面 航空航天材料 electron beam curing composite interface
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参考文献4

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二级参考文献2

  • 1吴季兰,辐射化学,1993年,13页
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共引文献11

同被引文献41

  • 1杜善义.先进复合材料与航空航天[J].复合材料学报,2007,24(1):1-12. 被引量:1031
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  • 3Walton T. C, Crivello J. V. The proceedings of the 41st International SAMPE Symposium[C]. March, 1996, 24-28: 1760-1772
  • 4Thomas C.Walton,James V.Crivello.Recent Advances in Electron-Beam Rapidly Cured Composite Polymers, 42nd International SAMPE Symposium. May 4-8,1997: 537-547.
  • 5J. Raghavan and Mark R. Baillie. Electron Beam Curing of Polymer Composites. Polymer Composites, August 2000,Vol. 21, No. 4:619-629.
  • 6J. Raghavan Vincent J. Lopata, and Mark R. Baillie.Influence Of Process Parameters On Electron Beam Curing Of A Polymer Composite. 30th International SAMPE Technical Conference, October 20-24,1998.
  • 7Frances Abrams, Tia Benson Tolle. An Analysis of E-beam Potential in Aerospace Composite Manufacturing. 42nd International SAMPE Symposium. May 4-8,1997: 548-557.
  • 8Allan S. Crasto, Ran Y. Kim and Brain P.Rice. Electron Beam Cure of Composites for Aerospace Structures. 42nd International SAMPE Symposium. May 4-8,1997: 487-493.
  • 9F. Guasti and E. Rosi.Low Energy Electron Beam Curing for Thick Composite Production. Composites Part A 28A (1997): 965~969.
  • 10Vincent J.Lopata. The Manufacture and Repair of High-Performance Composites Using Electron Beam Curing. Mat Tech 1999 14 2:63-70

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