摘要
采用真空蒸镀与化学镀两种方法制备GaN基发光二极管(LED)金电极,分析比较了两种工艺所得芯片成本、外观色差、打线拉力。结果表明,化学镀金可选择性还原欲沉积的金属于电极上,较之蒸镀整面金属,可大幅度节省金属成本,且操作简单易行。化学镀金法所制得金属层,较蒸镀法所制得金属层表面粗糙,可有效减少电极间的色差,且能提高打线或焊线的附着力。
GaN-based light-emitting diode（LED） electrodes are prepared by vacuum evaporation and chemigold plating. The resulting chip cost, appearance of colour aberration and wire adhesion of the two processes are analyzed and compared. The results show that the chemigold plating optional restores the metal to be deposited on the electrode. Compared to deposite the entire surface of the metal, it can save the metal costs, and the operation is simple. The metal layer obtained by chem igold plating method is rough than that obtained by rapor plating method. The chemigold plating method can effectively re duce the colour aberration between the electrodes, and can improve the adhesion of the wire bonding or wire solder.
出处
《光学与光电技术》
2013年第3期90-92,共3页
Optics & Optoelectronic Technology
关键词
真空蒸镀
化学镀金
发光二极管
色差
附着力
vacuum evaporation
ehemigold plating
GaN
LED
colour aberration
adhesion
