摘要
随着芯片引脚间距的减小以及芯片焊接温度的降低,更高频率的超声波换能器在芯片封装行业中有着广泛的应用前景。通过有限元分析软件ANSYS10.0建立了工作频率为133kHz的超声换能器的有限元模型,研究其工作频率附近振动模态特性,结果表明,超声换能器易产生频率混叠现象,导致焊接质量下降。采用频率灵敏度分析法对换能器结构参数进行优化,使工作模态频率与非工作模态频率的最小间隔由0.7kHz增加到4.6kHz,有效地抑制了频率混叠。使用安捷伦阻抗分析仪对加工的超声换能器的阻抗特性进行测试,仿真结果与测试结果能够很好地吻合。
The decrease of the pin pitch and the reduction of the bonding temperature urgently demand higher frequency ultrasonic transducer. The Finite Element Model （FEM） of the ultrasonic transducer working at 135kHz was built by the commercial soft- ware ANSYS10.0. The vibrating modes near the working frequency were investigated. Closely to the working mode, there were some un-wanted modes that could be easily excited and would have a great effect on the bonding quality. The size of the transduc- er was optimized based on sensitivity analysis, and the minimum interval of the frequencies between the working mode and the un- wanted modes was increased from 0.7kHz to 4.6kHz, which effectively inhibited the frequency aliasing. At last, the impedance characteristics of the transducer were tested using an impedance analyzer, and the simulation results agreed well with the meas- ured ones.
出处
《现代制造工程》
CSCD
北大核心
2013年第8期68-71,共4页
Modern Manufacturing Engineering
基金
浙江省自然基金项目(R1100015)
关键词
频率混叠
超声换能器
引线焊接
灵敏度分析
frequency alias
ultrasonic transducer
wire bonding
sensitivity analysis
