摘要
由于电子元器件组装及后续的设备安装运行过程中对于嵌入式器件与PCB的结合力(常用推出力表征)的严格要求,在制作含嵌入式器件PCB的过程中,需重点研究影响嵌入式器件推出力的因素及其控制方法。本项目设计正交试验,以PCB板厚、嵌入式器件锯齿数量、器件嵌入PCB开槽内的深度以及PCB开槽内镀铜厚度等四个因子各2两个水平进行试验研究,从而得出不同嵌入式器件推出力需求下的PCB板厚设计、嵌入式器件设计以及其它相关工艺参数等设计准则。
Due to the strict demands of combination between press-fit components and PCB （or push-out force） from the assembly and operation, the research on the factors influencing press-fit components push-out force is necessary during manufacturing of PCB with press-fit components. The factors such as PCB thickness, saw-tooth number of press-fit components, fit depth of press-fit components and copper plate thickness with two levels are studied in orthogonal experiment. Design formula of PCB with press-fit components is obtained from the orthogonal experiment.
出处
《印制电路信息》
2013年第9期33-37,70,共6页
Printed Circuit Information
关键词
嵌入式器件
推出力
正交试验
设计准则
Press-fit Components
Push-out Force
Orthogonal Experiment
Design Formula
