摘要
介绍一种以热塑性聚醚酰亚胺 (PEI)来改性双马来酰亚胺 (BMI)树脂 ,制成无溶剂的热熔型胶粘剂 ,其室温拉伸剪切强度≥ 11MPa ,2 2 0℃时≥ 14MPa。
In this paper a solvent free hot melt adhesive obtained by thermoplastic polyetherimide (PEI) modified bismaleimide (BMI) is introduced. This heat resistant adhesive has tensile shear strength ≥11MPa and 14MPa, respt 25℃ and 220℃。
出处
《中国胶粘剂》
CAS
2000年第6期8-9,共2页
China Adhesives
