摘要
文章对金属基微带板材料性能进行了简单介绍,对铜基微带板的工艺流程及技术进行了详细说明。
In this paper, the material properties of the metal based microstrip plate are introduced and the process and technology of copper based microstrip plate are described in detail.
出处
《印制电路信息》
2013年第10期63-66,共4页
Printed Circuit Information
关键词
铜基微带板
镀金
盲孔
孔金属化工艺
Copper Based Microstrip Plate
Gold-Plating
Blind Hole
Hole Metallization Technology
