摘要
研制了一种适用于Sn-Cu系无铅焊料的免清洗助焊剂,该助焊剂以去离子水作溶剂,降低VOC物质的含量,具有绿色环保的意义,实验对活化剂、表面活性剂、助溶剂以及成膜剂等主要成分进行了优化选择,并对其性能进行了检测。结果表明,实验制备的助焊剂无卤素,固含量低于5%,焊后残留无腐蚀性,离子污染度低,符合免清洗要求,助焊性能良好,平均扩展率达到78%。
A kind of no-clean flux for lead-free Sn-Cu solder was prepared. For the preparation of the flux, the deionized water was served as the solvent, and it was environmental protection because of the re- duced content of VOC. The active agents, surfactants, auxiliary solvent, and film forming emulsifiers in flu- xes were selected respectively. The composition was optimized, and the properties were tested for the flux. The results suggested that the flux is halogen free, non-corrosive of residue,low solid（ less than 5% ） and low ion contamination. The diversified properties of the no-clean flux met the standard requirements, and it achieved an excellent soldering performance and an average expansion rate of 78%.
出处
《应用化工》
CAS
CSCD
2013年第10期1782-1785,1788,共4页
Applied Chemical Industry
基金
国家军品配套项目(JPPT-125-GH-039)
中南大学研究生自主探索创新项目(2013zzts173)
关键词
无铅焊料
助焊剂
水基
焊接性能
lead-free solder
flux
water-based
soldering performance
