期刊文献+

可压缩条件下超弹性电子封装材料中孔穴的增长问题

VOID GROWTH OF HYPERELASTIC ELECTRONIC PACKAGING MATERIALS UNDER COMPRESSIBLE CONDITION
原文传递
导出
摘要 考虑了温度改变对高聚物材料体积变化的影响,将材料的不可压缩假定修正为可压缩假定.对具有neo-Hookea特征的高聚物电子封装材料在回流焊过程中由于湿热所引发的"爆米花"式的孔穴破裂现象进行了理论研究.利用有限变形的理论给出此类材料在计及体积改变效应下的孔穴增长和吸湿产生的蒸气压力与热应力之间的广义解析关系.该广义解析关系包含了不可压缩条件下的解析关系.分析结果表明:当温度改变引起的可压缩效应较大时,利用可压缩假定分析得到的极限载荷值与利用不可压缩假定分析得到的极限载荷值相比有所提高.但当温度改变引起的可压缩效应较小时,利用两种假定分析得到的极限载荷值相差不大.在温度变化范围不大的情况下,采用不可压缩的假定是合理的. The assumption of materials' incompressibility was amended to compressibility when the effect of temperature change on the volume of polymer materials was taken into account.Theoretical analysis of the popcorn void crack in the neo-Hookea polymer materials undcr the effect of hygro thermal during reflow soldering was achieved.Based on finite deformation theory,a general analytical solution relating the void growth to the vapor presser and thermal stress was obtained when the volume of material changes due to temperature.The general analytical solution included the analytical solution of the incompressible material as a special case.The analysis results showed that,taking the effect of volume expansion of polymer materials into account,the critical load would be increased.If the expansion coefficient is smaller,the effect of volume expansion on the evolution of the void will be less.Therefore,the incompressible hypothesis is reasonable when the temperature variation range is small.
出处 《固体力学学报》 CAS CSCD 北大核心 2013年第5期487-492,共6页 Chinese Journal of Solid Mechanics
基金 国家自然科学基金资助项目(11172195) 山西省自然科学基金(2012011019-4)资助
关键词 孔穴 可压缩 体积膨胀 '爆米花'式失效 void compressible volume expansion popcorn failure
  • 相关文献

参考文献10

  • 1Fan X J,Zhang G Q,Van Driel W,Ernst L J. Analyti cal Solution for Moisture-Induced Interface Delamina- tion in Electronic Packaging [C]. Proceedings of Elec- tronic Components and Technology Conference,Unit ed States, 2003,5 : 27-30, Institute of Electrical and E- lectronics Engineers Inc, 2003 : 733-738.
  • 2Fan X J,Zhang G Q,Van Driel W,Ernst L J. Mecha- nism Based Delamination Prediction During Reflow with Moisture Preconditioning [C]. Proceedings of the 5th International Conference on Thermal and Me- chanical Simulation and Experiments in Microelec- tronics and Microsystems, Belgium, 2004,5 : 10-12, In- stitute of Electrical and Electronics Engineers Inc, 2004:329-335.
  • 3Fan X J, Zhou J, Zhang O Q. A micromechanics-based vapor pressure model in electronic packages[J]. Jour- nal of Electronic Packaging, Transactions of the ASME,2005,127(3) :262-267.
  • 4Gent A N, Lindley P B. Internal rupture of bonded rubber cylinders in tension [J]. Proceedings of the Royal Society of London, 1958,249 : 195-205.
  • 5Ball J M. Discontinuous equilibrium solutions and car itations in nonlinear elasticity [J].Philosophical Transactions of the Royal Society London, 1982,306: 557-610.
  • 6任九生,程昌钧.热超弹性材料中的空穴生成问题[J].固体力学学报,2004,25(3):275-278. 被引量:7
  • 7任九生,程昌钧.超弹性材料的不稳定性问题[J].力学进展,2009,39(5):566-575. 被引量:9
  • 8任九生,周琎闻,袁学刚.高压胶管的动力响应分析[J].固体力学学报,2010,31(S1):128-133. 被引量:3
  • 9任九生,袁学刚,程昌钧.生长对超弹性球壳变形和稳定性的影响[J].力学学报,2011,43(6):1110-1116. 被引量:3
  • 10李志刚,树学峰.湿热作用下热超弹性材料在电子封装中的分层失效问题[J].固体力学学报,2011,32(5):459-464. 被引量:3

二级参考文献39

共引文献14

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部