摘要
基于层层沉积法,引入简单易控的热处理方式在玻璃基底表面制备出高结晶度且致密无裂缝的Cu3(BTC)2膜,并详细探讨热处理温度、组装时间和组装溶剂对Cu3(BTC)2成膜的影响。FESEM分析结果显示:膜层的厚度仅为200nm;热处理有利于获得完整的晶体结构,且高温下膜层不会产生裂纹;组装时间为5min或10min,Cu3(BTC)2颗粒尺寸小且均一。然而,当组装时间延长至20min,尺寸变得不均一,膜层表面变粗糙;通过改变组装溶剂环境,可以制备出不同维数的晶体膜。
Based on layer-by-layer deposition,heat treatment was introduced to prepare continuous and defect-free Cu3（BTC）2 film on glass substrate.The effects of some parameters including heat treatment temperature,assembly time and solvent were investigated with field emission scanning electron microscopy（FESEM）.The results showed that film thickness was only about 200 nm which was much thinner than those previously reported.Heat treatment was fantastically beneficial for high crystallinity Cu3（BTC）2 film formation and no crack was found in the film even at a high heat treatment temperature. At the assembly time about 5 min or 10 min,small crystal particles with uniform size were obtained. However,at a longer assembly time of 20 min,particle size became non-uniform,leading to film unevenness. Moreover,by changing the assembly solvent environment,films with different dimensions were formed.
出处
《化工学报》
EI
CAS
CSCD
北大核心
2013年第11期4255-4261,共7页
CIESC Journal
基金
国家重点基础研究发展计划项目(2013CB733503)
国家自然科学基金项目(21136001,21136004)
国家高技术研究发展计划项目(2006AA03Z455)~~
