摘要
作为一种新型的集成封装技术,低温共烧陶瓷(LTCC)技术以其优良的高频和高速传输特性,小型化、高可靠性而备受关注。由此可见研究如何利用LTCC技术开发高性能的小型化无源器件对于无线通信产品的发展是有实际意义的。LTCC技术能充分利用三维空间发展多层基板技术,其产品在封装和小型化方面具有明显优势;LTCC技术具有损耗小、高频性能稳定、温度特性良好等特点。同时介绍了国内外LTCC元器件发展现状和趋势,以及基于LTCC技术的无源器件的设计和应用。
As a new type of integrated packaging technology, low temperature co-firing ceramic （LTCC） technology for its excellent high frequency and high speed transmission characteristics, miniaturization, high reliability and is a major concern. So study how to make use of LTCC technology to develop high-performance miniaturization passive components is has practical significance for the development of wireless communication products. This article summarizes the LTCC technology can make full use of the three dimensions of space development of multilayer substrate technology, its products in packaging and miniaturization has obvious advantages; LTCC technology with low loss, high frequency stability, good temperature characteristic and other characteristics; LTCC components development status and trend at home and abroad. This paper introduces the LTCC technology design and application of passive components.
出处
《电子与封装》
2013年第10期10-13,共4页
Electronics & Packaging
关键词
LTCC技术
无源器件
设计
应用
LTCC technology
passive components
design
application
