摘要
设计了一种基于MCM-D工艺的C波段微波组件。采用薄膜多层布线和芯片倒扣焊技术,实现了良好的分布参数控制。在小封装内集成了微波放大、滤波、变频,中频滤波、放大和真对数动态压缩等电路单元,实现了高性能的微波信号处理集成。
A C-band microwave module was designed based on MCM technology, in which thin-film multilayer wiring and flip-chip were used to achieve good distributed parameter control. Microwave amplification, filtering, frequency converter, intermediate frequency filter, amplifier and true logarithmic dynamic compression circuit cells were incorporated into a small package to implement high performance microwave signal processing integration.
出处
《微电子学》
CAS
CSCD
北大核心
2013年第5期667-670,共4页
Microelectronics
