摘要
研制了一种室温固化耐高低温环氧胶黏剂。E-51与低黏度的711环氧树脂配合使用作为主体树脂,同时使用20%wt的自制增韧剂增韧,胶黏剂的综合性能较好,且具有良好的耐高低温性能。胶黏剂室温固化24h即能接近完全固化,耐介质和耐湿热老化性能优异。所制胶黏剂黏度低,可用于粘接和灌封。
A high and low temperature resistant epoxy adhesive which can be cured at room temperature is developed.The E-51 and 711 epoxy resin with lower viscosity is used as the matrix resin.When the 20％（wt） toughening agent is added to the system,the comprehensive properties of adhesive is improved,and it has good high and low temperature resistance.The adhesive can be mostly cured after 24h at room temperature.It shows good performance in experiments of medium-resistance and hygrothermal ageing resistance.The adhesive can be used as adhesive and encapsulant for its low viscosity.
出处
《化学与粘合》
CAS
2013年第6期13-15,31,共4页
Chemistry and Adhesion
关键词
环氧
胶黏剂
粘接
灌封
耐高低温
Epoxy
adhesive
adhesion
encapsulant
high and low temperature resistant
