摘要
开发了一种新型内层铜箔CS-2203棕化液，其组成（以体积分数表示）和工艺条件为：质量分数为50％的硫酸3．5％～4．5％，质量分数为35％的双氧水4．5％～5．5％，CS-2203棕化剂2．2％～3．2％，时间50～60s，温度30～40℃。CS-2203棕化剂的组成为：98％（质量分数）硫酸90～120g／L，30％（质量分数）双氧水10～25g／L，改性苯并三唑50～100g／L，聚酸酰胺80～100/L，稳定剂B0．5～1．0g／L，邻苯二甲酸二甲酯微量。对CS-2203棕化膜的热应力性能、抗剥强度、表面形貌等进行表征。结果表明，新型CS-2203棕化液处理所得棕化膜可显著促进铜表面与粘结片之间的结合，抗热冲击性能良好，抗剥离强度高，综合性能满足客户的要求。该工艺流程简单，适用性广，成本低。
A novel CS-2203 brown oxidation bath for inner foils was developed. The bath composition and process conditions are as follows： 50wt% sulfuric acid 3.5vol%- 4.5vol%, 35wt% hydrogen peroxide 4.5vol%-5.5vol%, CS-2203 brown oxidation agent 2.2vol%-3.2vol% , temperature 50-60 ℃, and time 50-60 s. The original CS-2203 brown oxidation agent is composed of 98wt% sulfuric acid 90-120 g/L, 30wt% hydrogen peroxide 10-25 g/L, modified benzotriazole 50-100 g/L, polylactic acid amide 80-100 g/L, stabilizer B 0.5-1.0 g/L, and a trace amount of dimethyl phthalate. The properties of brown oxidation film including thermal stress, peel strength, and surface morphology were characterized. The results showed that the brown oxidation film obtained from the novel CS-2203 brown oxidation bath significantly promotes the bonding between copper substrate and bond ply. The brown oxidation film has excellent thermal shock resistance and high peel strength. Its comprehensive performance meets clients＇requirement. The given process features simple flow, wide applicability, and low cost.
出处
《电镀与涂饰》
CAS
CSCD
北大核心
2013年第12期35-38,共4页
Electroplating & Finishing
关键词
印制线路板
内层铜箔
棕化
热应力
抗剥强度
printed circuit board
inner foil
brown oxidation
thermal stress
peel strength
