摘要
电子封装互连过程中，无铅锡基焊料是常用的连接材料。然而，由于其较高的熔点（210～240℃），在电子器件连接过程中需施加较高的回流温度，这不仅增加了电子组装过程中的能耗，也大大降低了器件的可靠性。纳米无铅焊料具有热力学尺寸效应，其熔点较块体材料有大幅度的降低，从而受到了越来越广泛的关注。综述了近年来国内外纳米无铅焊料的发展动态，介绍了常用的纳米无铅焊料的制备方法及影响纳米颗粒尺寸的因素，总结了纳米无铅焊料在应用和存放过程中所产生的问题，同时也对纳米无铅焊料未来产业化的实现提出了建议。
Lead-free solder alloys are widely used in electronic packaging. However, due to the limitation of their high melting point （210-240 ℃）, a great temperature must be applied during soldering. The increased working temperature not only increases the energy consumption but also threatens the joint reliability. Nano lead-free solder alloys are being attracted more and more attentions because the melting point of an alloy in hang size is much lower than that in normal size due to the thermodynamic size effect. Review the recent domestic and international developments of the nano lead-free solder alloys, introduce their preparation methods and influencing factors, summarize the problem during their application and storage, and finally, propose some advice in their industrial implementation.
出处
《电子工艺技术》
2014年第1期1-5,44,共6页
Electronics Process Technology
基金
国家自然科学基金项目(项目编号:51175116)
深圳市战略新兴产业发展专项资金项目(项目编号:CXZZ20120829103358067)
关键词
纳米无铅焊料
微电子组装
焊接
Nanolead-free solder
Micro-electronic packaging
Soldering
