摘要
介绍一种在封装工艺中可用于替代昂贵金丝的抗腐蚀高可靠性银合金丝。利用表面钝化和固溶合金、二次中频合金熔炼和定向连续拉铸工艺,分别从成分和工艺方面提高了银合金丝的机械性能、抗腐蚀性、可靠性等一系列键合性能,解决了普通银丝在使用过程中存在的电子迁移问题,推动了键合银合金丝的广泛使用。
The paper introduces the silver bonding wire with high corrosion resistance and reliability, which can be used to instead of the expensive gold bonding wire. Surface passivation, solid amalgamation alloy, secondary intermediate smelting and directional continuous casting process are used to produce YesNo silver bonding wire. It improves the mechanical property, corrosion resistance, reliability and other bonding performance of the silver bonding wire from the component and processes. Silver bonding wire has solved the electron transfer problem in ordinary silver bonding wire. Silver bonding wire is more and more used.
出处
《电子与封装》
2014年第3期9-13,共5页
Electronics & Packaging
关键词
键合银合金丝
表面钝化
固溶技术
二次中频熔炼
定向连续拉铸
抗腐蚀性
高可靠性
silver based bonding wire
surface passivation
solid amalgamation alloy
secondary intermediate smelting
directional continuous casting
corrosion resistance
high reliability
