摘要
文章通过对电镀软金过程采用不同的电镀时间,电流密度,电镀次数形成不同的金、镍层厚度的板件,用盐雾和酸雾实验研究不同工艺加工的金面耐腐蚀性差异,结果发现金厚是影响金面耐腐蚀性的关键因素,文章还对金面的耐腐蚀性机理进行了探讨。
The paper test the gold surface corrosion resistance of PCB with using salt fog and acid fog experiments. The gold surface was produced by soft gold plating with different processing technology that including plating time, current density. The result found that thickness of gold is the key factor. The paper also probes the failure theory of the gold surface corrosion resistance.
出处
《印制电路信息》
2014年第4期95-101,共7页
Printed Circuit Information
关键词
镀金
金面
耐腐蚀
Soft Gold Plating
Gold Surface
Corrosion Resistance
