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嫦娥三号探测器热控系统设计与验证 被引量:28

Design and verification of thermal control system for Chang'E-3 probe
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摘要 嫦娥三号探测器是我国第一个成功实现月球软着陆和月面生存的航天器,探测器热控系统研制重力驱动两相流体回路、可变热导热管、高温隔热屏、同位素热源(RHU)等首次在国内航天器上使用的新产品,并解决月面g/6重力地面模拟、着陆发动机高温边界模拟等试验难题,成功突破了月球软着陆、长期月面生存相关的热控技术.热控系统及关键热控产品在轨工作正常,探测器设备温度满足指标要求,圆满完成了探测器工程任务并获得了宝贵的在轨数据.本文对热控系统设计约束、设计方案、关键产品及在轨验证情况进行介绍. Chang'E-3 probe is the first Chinese spacecraft landed on the lunar surface and survived for lunar day/night cycles. The Chang'E-3 thermal control system developed new elements such as closed two-phase thermosyphons, variable conductance heat pipes (VCHP), high-temperature adiabatic shield and radioisotope heater units (RHU) to deal with the harsh environment. Ground test methods for simulating the effect of lunar gravity and descent engine were established as well. Thermal control system worked well in orbit and on the lunar surface, and maintained the probe components and structure within the required range of temperatures throughout the mission. First-hand data of the lunar surface probe, which is useful for the future mission, was obtained during the flight test. This paper introduces the primary requirements, chief factors and the characteristics of the thermal control system design. The final scheme, key elements and flight performance of thermal control system are also described.
出处 《中国科学:技术科学》 EI CSCD 北大核心 2014年第4期353-360,共8页 Scientia Sinica(Technologica)
关键词 热控系统 月球软着陆 月面生存 两相流体回路 可变热导热管 同位素热源 thermal control system, lunar soft landing, lunar survival, two-phase thermosyphons, VCHP, RHU
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参考文献4

  • 1Preter E. The Lunar Base Handbook. NewYork: The McGraw-Hill Companies, Inc., 1999. 140-141.
  • 2Gaier J R, Jaworske D A. Lunar dust on heat rejection system surfaces: Problems and prospects. NASA/TM-2007-214814, 2007.
  • 3Gaier J R,Siamidis J, Panko S R, et al. The effect of simulated lunar dust on the absorptivity, emissivity, and operating temperature on AZ-93 and AG/FEP thermal control surfaces. NASA/TM-2008-215492, 2008.
  • 4Agui J H, Nakagawa M. Dust on the Moon and Mars. AIAA 2005-539, 2005.

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