摘要
选用四种树脂作为成膜剂配制四种助焊剂,通过铺展性能和表面形貌评价助焊剂的性能。结果表明:季戊四醇脂成膜剂能在焊接温度下形成保护膜包覆焊点。改变助焊剂中季戊四醇脂成膜剂的含量,进行铺展性能、储存稳定性和其他性能测试,结果表明:成膜剂的添加有助于铺展面积的增加,当其质量分数为10%时,焊点铺展率到达稳定值约为86%;成膜剂的添加对助焊剂的存储稳定性影响较大,当其质量分数为15%时焊锡膏在常温下的保存时间可达到18 d;同时成膜剂的添加对助焊剂中不挥发物含量及焊后残留物影响较大。
In order to study the effect of film former on the performances of flux, four kinds of resins were used to prepare four different kinds of fluxes. The performances of flux were investitgated with the tests of expansion and surface morphology. The results indicate that pentaerthritol ester can form film and protect solder joint during soldering process. More detailed investigation was also carried out. The content of pentaerthritol ester was changed, and the properties were studied for the fluxes. The results show that with increasing the content of film former the spreading rate increased. The spreading ratio was all about 86% when the content of film former is about 10%wt. The contents of film former influence storage stability of solder paste in large extents. When the content of film former is 15%wt, the solder paste can store for 18 days at closed room temperature. Moreover, the content of film former influence nonvolatile content, flux residues of flux in some extents.
出处
《电子工艺技术》
2014年第3期125-127,163,共4页
Electronics Process Technology
基金
陕西省重点学科建设专项资金项目(项目编号:00×902)
关键词
低松香型助焊剂
成膜剂
铺展性
Low rosin soldering flux
Film former
Spreading performance
