摘要
阐述了ULSI衬底硅单晶片清洗的重要性 ,详尽介绍了目前世界上采用的各种清洗方法 (湿法、干法、兆声、激光等 )的发展概况、应用价值及发展方向 ,并提出晶片清洗的发展趋势将向多元化、综合化和专用化方向发展。
The significance of the silicon wafer cleaning in ULSI was described. The general conditions, application values and developing direction of several kinds of cleaning methods which are being used in a wide range were introduced, and the tendency of wafer cleaning diversity, synthesis and specialty was also presented.
出处
《稀有金属》
EI
CAS
CSCD
北大核心
2001年第2期134-138,共5页
Chinese Journal of Rare Metals
