摘要
随着绝缘栅双极型晶体管等功率器件的发展,对陶瓷敷铜基板(DBC)的需求越来越大。分别介绍了DBC基板的种类、结构,预氧化工艺对DBC基板的影响和敷接机理。用扫描电镜、X射线衍射等分析手段确定铜箔表面氧化后的物相成份,用X射线扫描确定敷接后界面空洞,并分析产生空洞的原因。用SEM观察界面的形貌并进行断面分析,用XRD和X-RAY分析界面产物的物相成份,从而确定DBC基板的敷接机理。
With the development of IGBT and power device, there is a higher demand for DBC. The article respectively describes the DBC category and structure, the affection the preformed oxidation to DBC and the bonding mechanism. The surface composition of the copper is confirmed by SEM and XRD, the void is conifrmed by X-ray, the paper also analyzed the causation to produce the void. The paper analyses morphology and section of the inter phase by SEM, and analyses the inter phase composition by XRD and X-RAY. The bonding mechanism is conifrmed.
出处
《电子与封装》
2014年第5期10-13,41,共5页
Electronics & Packaging
关键词
DBC
敷接机理
预氧化
direct bond copper
bonding mechanism
performed oxidation
