摘要
为了解决智能移动终端局部过热的问题,从平面热布局面积入手,采用热传导技术,抓住多模智能移动终端热源器件布局的关键,给出一个考虑散热的布局最小面积;根据热流密度来计算结构的整机高度。通过热仿真来进行布局和结构设计的模拟,给出结构设计的参考意见,最后通过测试去验证和完善热设计。经过实际产品的发热红外图谱分布试验,获得智能移动产品实际的温度分布平面图,得到了与仿真一致的结论。
In order to solve the local overheating problems existing in intelligent mobile terminal, starting from the plane layout area, the heat conduction technology is adopted to catch the key of heat source device layout for multimode intelligent mobile terminal. The minimum layout area, taking account of heat dissipation, was obtained. The height of the complete machine structure was calculated according to heat flux density. The layout and structure design were simulated through thermal simulation technology. A reference comment about structure design is givenb in this paper. The test is performed to verify and improve the thermal design. The beating infrared spectrum distribution test was applied to an actual product. The temperature distribution plan of intelligent mobile products was obtained. A conclusion which was in keeping with simulation was obtained.
出处
《现代电子技术》
2014年第12期129-133,共5页
Modern Electronics Technique
基金
国家重大科研科技项目:TD-LTE及TD-LTE-Advance终端一致性规范研究(2012ZX03001040)
关键词
智能终端
热仿真
热设计
热流密度
热源器件
smart terminal
thermal simulation
thermal design
thermal density
thermal source component
