摘要
叠层片式PTC热敏陶瓷(MLPTC)具有尺寸小、质量轻、电阻低、通流量大、反应快、无明火、无触点、无噪音和可修复等优点,可作为低压电路中过流保护和温度补偿等元件。介绍了叠层片式PTC热敏陶瓷的发展历程和研究现状,以及该样品基体配方的研究,分析了当前制备工艺中存在的问题,并提出了解决的方法,同时指出叠层片式PTC热敏陶瓷向着低阻化、片式化、微型化和绿色化方向发展。
The multilayer chip-type PTC ceramics possess small size, light weight, well stability and good enduring large current rushing, which are used to the component of the over current protection in low-voltage circuit and the compensation on the temperature. The development history, the research status and the matrix formulation of the multilayer chip-type PTC ceramics are introduced. The existent problems on the current preparation technology are analyzed, and the solutions are given as well. Meanwhile, the developmental trends of the green, micromation, chip type and resistance lowering for the multilayer chip-type PTC ceramics are put forward.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2014年第7期4-7,28,共5页
Electronic Components And Materials
基金
国家自然科学基金资助项目(No.61179055)
广东省教育厅自然科学育苗工程项目资助(No.2013LYM0099)
肇庆学院青年基金资助项目(No.201320)
肇庆学院博士启动基金资助项目
关键词
BATIO3陶瓷
PTC效应
综述
热敏陶瓷
叠层片式
低阻化
BaTiO3 ceramics
PTC effect
review
thermistor ceramics
multilayer chip-type
resistance lowering
