摘要
在Y2 O3 Al2 O3 SiO2 (YAS)钎料中添加TiO2 (YT)和Si3N4(YN) ,并进行氮化硅陶瓷的连接。用四点弯曲方法测定不同连接工艺下的连接强度 ,并对连接界面进行SEM ,EPMA和XRD分析。接头强度随着保温时间、连接温度的增加 ,而逐渐增加。在达到峰值后 ,连接强度逐渐降低。在YAS中添加TiO2 ,可以形成Si3N4/Y Sialon玻璃 +TiN/TiN/Y Sialo玻璃的梯度层界面 ;而在YAS钎料中添加Si3N4,可以降低接头界面的热应力 ,改善接头强度。微观分析表明 :接头强度的变化主要与界面反应有关。
Bonding of Si 3N 4 ceramics was performed with Y 2O 3 Al 2O 3 SiO 2(YAS) X glass solders, which were mixed with TiO 2 (YT) and Si 3N 4(YN) respectively. The effects of bonding conditions and interfacial reaction on the joint strength were studied. The joint strength of different bonding conditions was measured by four point bending tests. The interfacial microstructures were observed and analyzed by SEM, EPMA and XRD respectively. It is shown that with the increase of bonding temperature and holding time, the joint strength increases reaching a peak, and then decreases. When TiO 2 is put into YAS solder, the bonding interface with Si 3N 4/Y Sialon glass+TiN/TiN/Y Sialo glass is formed. When YAS solder is mixed with Si 3N 4 powder, the interfacial thermal stress may be decreased, and the joint strength is enhanced. According to microanalyses, the bonding strength is related to interface reaction.
出处
《中国稀土学报》
CAS
CSCD
北大核心
2001年第1期27-31,共5页
Journal of the Chinese Society of Rare Earths
