摘要
分别采用单槽法和双槽法电沉积制备 Cu/ Ni多层膜 .研究了两种电沉积方法制备多层膜的工艺条件 ,并利用俄歇电子能谱和扫描电子显微镜 (SEM)确定镀层结构 .通过对比 。
In this paper Cu/Ni multilayers were prepared by using single-bath and double-bath methods respectively.The technological conditions were studied,and the multilayer structure was studied by using Auger and SEM.In addition,on the basis of experiment,the single-bath and double-bath methods were compared.
出处
《天津大学学报（自然科学与工程技术版）》
EI
CAS
CSCD
北大核心
2001年第2期261-264,共4页
Journal of Tianjin University：Science and Technology
基金
国家自然科学基金资助项目
