摘要
The deposition of silicon dioxide by plasma enhanced chemical vapor deposition from tetraethylorthosilicate (TEOS) and H_2O has been studied.Silicon oxide with refractive index of 1453 has been obtained.Tests on the 51mm wafers show that both thickness uniformity of ±15% and constant refractive index of 1453 can be achieved.By raising the deposition temperature,the qualities have been improved,while the deposition rate decreased.A SiO_2 thick film deposition technique has been developed combining TEOS-PECVD technique with high temperature annealing.
开展了使用 TEOS和 H2 O混合物进行 PECVD生长 Si O2 膜的研究工作 .氧化硅折射率分布在 1.45 3±0 .0 0 1的范围 ,且随偏离中心距离基本不变 .薄膜厚度是中央大 ,边沿薄 ,其厚度相对变化不超过± 1.5 % (5 1mm衬底 ) .利用 TEOS源 PECVD,并结合退火技术 ,摸索出厚膜氧化硅生长工艺 ,已成功地在硅衬底上生长出厚度超过 15 μm氧化硅厚膜 ,可用于制备氧化硅平面波导器件 .
基金
国家自然科学基金! (698762 60和 6988970 1)
国家重点基础研究资助项目! (G2 0 0 0 0 3 660 4)&&
