摘要
With the scale of integration and operation speed of modern ICs increasing,a series of thermo-related problems arise.Hot spots,which are due to the uneven distribution of heat,invalidate some functions of the chip.An algorithm is presented to calculate the profile.With the boundary element method,3D problems are converted into 2D ones,so the temperatures of both the chip surface and inner points can be calculated quickly.This algorithm can be used to evaluate the thermal quality of a definite chip.
现代芯片技术在集成度和速度方面的进步带来一系列热相关的问题 ,非均匀分布热源引起的局部热点很可能会使整个芯片失效 .提出一种计算芯片温度分布的算法 ,采用边界元方法将三维问题转化为二维问题 ,这样可以快速计算出芯片边界和内部的温度分布 .适用于对 VL SI芯片进行热评估 .
基金
国家自然科学基金海外学者合作基金资助项目! (批准号 :CAD 6992 840 2 )&&
