摘要
采用银基活性钎料 (Ag- Cu- Ti)对二维层间增强型和三维正交增强型 C/C复合材料进行了真空钎焊工艺试验 ,采用扫描电镜 (SEM)观察了钎焊接头和连接界面的微观组织形貌 ,测定了各元素的面分布 ,对钎焊接头进行了室温压缩剪切性能试验和三点弯曲强度试验。结果表明 :钎料中的元素 Ti向钎料和 C/C界面区扩散并富集 ,生成了含元素 C的 Ti2 Cu化合物相 ,形成了钎料对 C/C基体的良好润湿 ,可获得组织致密的接头 ,接头室温三点弯曲强度为 :38MPa,抗剪强度为 2 2
The two dimensional interlamellar reinforced and three dimensional orthogonal reinforced carbon/carbon composites were vacuum brazed using Ag based active brazing filler metal(Ag Cu Ti) The microstructure of the joints, especially the interface structure was investigated by SEM, and the element distributions of the joints were examined The compression shear strength and three point bend strength of the joints were measured at room temperature The results showed that, the element Ti accumulated at the interface of carbon/carbon composites/ filler metal alloy and the compound Ti 2Cu containing element C were formed there, so the wettability of the filler on carbon/carbon composites was improved Compacted joint microstructure could be obtained The joints show shear strength of 22MPa and three point bend strength of 38 MPa
出处
《材料工程》
EI
CAS
CSCD
北大核心
2002年第1期9-11,48,共4页
Journal of Materials Engineering
基金
航空基础科学基金资助项目 ( 96 H2 10 0 8)
