摘要
氮化铝陶瓷具有高导热率、高温绝缘性和优良介电性能、良好耐腐蚀性、与半导体Si相匹配的膨胀性能等优点,是理想的电子封装散热材料。本文对氮化铝陶瓷粉体制备、成型工艺、烧结等方面的关键技术做出了总结,其中着重总结了氮化铝陶瓷烧结方面的技术发展现状。最后对高导热氮化铝陶瓷制备技术进行了展望。
Aluminum nitride ceramics has the advantage of high thermal conductivity, high temperature insulation, excellent dielectric properties, good corrosion resistance and matching expansion properties with semiconductor Si, which is an ideal material for electronic packaging. The key technologies of aluminum nitride ceramic powder preparation, molding process and sintering are summarized. This paper focuses on the status of the technological development in the sintering of aluminum nitride ceramics. The key technologies of high thermal conductivity aluminum nitride ceramics are forecasted at the end.
作者
吕帅帅
周宇翔
倪威
马立斌
何竟宇
倪红军
LU Shuaishuai;ZHOU Yuxiang;NI Wei;MA Libin;HE Jingyu;NI Hongjun(School of Mechanical Engineering,Nantong University,Nantong 226019,Jiangsu,China;Laiding Electronic Materials Technology Co.,Ltd.,Nantong 226019,Jiangsu,China)
出处
《陶瓷学报》
CAS
北大核心
2018年第6期672-675,共4页
Journal of Ceramics
基金
江苏高校优势学科建设工程资助项目(PAPD)
江苏省重点研发计划(产业前瞻与共性关键技术)项目(BE2018093)
江苏省墙体材料革新科研项目(201703)
关键词
高导热
氮化铝
粉体制备
成型
烧结
high thermal conductivity
aluminum nitride
powder preparation
molding
sintering
