摘要
热设计在星载电子产品中具有及其重要的地位,热设计的好坏直接决定产品的可靠性。文章采用一种"热桥"的结构形式来提高大功率芯片的散热。借助ANSYS/workbench热仿真模块,分析了改进前后印制板组件中芯片的温度,验证该结构形式的有效性。在此基础上,对搭建"热桥"的散热片材料及规格进行了比较。
Thermal design has an quality extremely important position in the satellite-borne electronic products,the quality of thermal design directly determines the reliablility of the products. A kind of thermal bridge structure form to increase the heat dissipation of high power chips is adopted. The simulation module of the ANSYS/workbench is used to analyze before and after the improvement of the temperature of the chip in the PCB components to verify the effectiveness of the proposed structure. On this basis,the building thermal bridge of heat sink has carried on the comparative analysis of materials and specifications.
作者
庄春跃
刘宽耀
刘伟平
翁孚达
ZHUANG Chun-yue;LIU Kuan-yao;LIU Wei-ping;WENG Fu-da(Shanghai Radio Equipment Research Institute,Shanghai 200090,China)
出处
《制导与引信》
2018年第3期56-60,共5页
Guidance & Fuze
关键词
星载
印制板
热仿真
散热片
satellite-borne
PCB
thermal simulation
heat sink
