摘要
电子设备中表面安装器件和电路基板以及焊接材料的热膨胀系数差异,使得SMT互连组件在热循环条件下产生热膨胀失配,在焊接处产生热应力,在长时间的交变应力的作用下,焊接处遭到疲劳破坏而使设备工作失效,这就是SMT互连组件在热循环条件下的基本失效机理。文中还介绍了美国MIL—HDBK—217F NOTICE Ⅱ公布的表面安装连接组件可靠性预测lSMT模型。给出一系列具有实用价值的参数。
The difference in coefficient of thermal expansion among the SMT components, circuit boards and solder in electronic equipment will result in unmatched thermal expansion between SMT interlink subassemblies and thermal stress at the welding joints in thermal cycles. The welding joints will fatigue and even break, which may cause the equipment failure. This is the failure mechanism of SMT interlink subassemblies.The reliability evaluation model for lSMT publicized by MIL-HDBK-217F NOTICEⅡis represented and some voluble data are given.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2002年第6期11-13,共3页
Electronic Components And Materials
关键词
SMT互连组件
热循环
失效
可靠性预测
电子
SMT interlink subassemblies
thermal cycle
failure
reliability evaluation
