期刊文献+

开路缺陷的软故障关键面积研究

A Study of Critical Area Extration for Soft Fault of Opens
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摘要 从软故障的产生机制出发 ,研究了软故障的作用模式 .为了计算软故障的关键面积 ,将互连线分为接触区和导电通道两部分来处理 ,并推导出了总的计算公式 .最后通过对一个 4× 4移位寄存器的软故障关键面积的计算 ,说明了在不同粒径缺陷情况下 ,软。 Based on the mechanism of soft fault occurring,its function mode is studied.A general formula to calculate the critical area is presented by dividing VLSI interconnects into two parts,contacting region and conducting path.Finally,the effect of hard and soft fault of different size of defect on circuits is given by calculating soft fault critical area of a 4×4 shift register.
出处 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2002年第6期651-654,共4页 半导体学报(英文版)
关键词 开路缺陷 软故障 硬故障 互连线 关键面积 集成电路 hard defect soft fault interconnect critical area
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参考文献9

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