摘要
利用电化学方法研究了B1 0合金在含有硫酸盐还原菌的PostgateC培养基中的腐蚀电化学为 .结果表明 ,在有菌培养基中 ,B1 0合金的腐蚀电位剧烈负移 ,腐蚀速率显著增加 ,同时 ,由于硫化物覆盖层的形成 ,其阳极极化曲线出现“钝化”现象 .电子探针测量表明合金发生了镍和铁的选择性溶解 。
Electrochemical techniques such as measurements of corrosion potential,the polarization resistance,and potentiodynamic scanning technique were used to investigate the electrochemical behavior of 90/10 Cu/Ni alloy in Postgate C medium containing sulfate reducing bacteria(SRB).The results showed that the corrosion potential of the alloy changed from -0.20 to -0.75 V(SCE) when bacteria inocula was added, and the polarization resistance R p decreased obviously,which corresponds to an increased corrosion rate. The shape ofthe anodic polarization curves was drastically changed in the presence of SRB, and an active_passive transition was observed. Electron probe microanalyzer was used to investigate the morphology and chemical composition of the corroded surface. The results showed that the dealloying of nickel and iron from the alloy happened,and the morphology was spongy. Based on these studies, a mechanism of SRB_influenced corrosion of the alloy was proposed.
出处
《电化学》
CAS
CSCD
2002年第2期191-194,共4页
Journal of Electrochemistry
基金
国防科技预研基金 ( 97J1 2 .2 .4
CB550 1 )资助项目
关键词
B10合金
铜-镍合金
微生物腐蚀
硫酸盐还原菌
Copper_nickel alloy, Microbiologically influenced corrosion (MIC), Sulfate reducing bacteria(SRB)
