摘要
研究了亚铁氰化钾和α ,α′ -联吡啶对陶瓷表面化学镀铜沉积速率、阻抗、镀层晶体结构和外观的影响。加入亚铁氰化钾 ,铜沉积速率降低 ,阻抗增大 ,镀层外观得到改善 ,镀层晶体呈无序生长 ;α ,α′ -联吡啶的加入对铜沉积的抑制更明显 ,镀层晶体取向为 (2 ,2 ,0 )。
The effect of potassium ferrocyanide and α,α′-dipyridyl on deposition rate, impedance, microstructure and appearance of electroless copper deposits on ceramic surface was studied. Results show that the addition of potassium ferrocyanide reduces the deposition rate, increases impedance of copper deposition, improves appearance of copper deposits, and results in the disordered crystal growth of copper deposits, while the addition of α,α′-dipyridyl restrains copper deposition further more, and transfers the crystal orientation of copper deposits to (2,2,0).
出处
《电镀与涂饰》
CAS
CSCD
2002年第3期24-28,共5页
Electroplating & Finishing
