摘要
对陶瓷二次金属化镀镍工艺及其工艺中需要注意的问题进行了探讨 ,并对镀镍层常见缺陷进行了分析。
In this paper, the typical process of second metalization-nickel electroplating and its main influenle factor are investigated, and the common imperfections appearing in nickel-coated layer are analyzed also. The technology has important action in its research and its application.
出处
《表面技术》
EI
CAS
CSCD
北大核心
2002年第4期29-31,共3页
Surface Technology
关键词
陶瓷
二次金属化
镀镍
工艺研究
连接
缺陷
Ceramic and metal joining
Nickel electroplating
Surface defect
Technology
