摘要
This work presents a semi-analytical model to explore the effects of cooling rate on the thermal shock resistance behavior of a functionally graded ceramic （FGC） plate with a periodic array of edge cracks. The FGC is assumed to be a thermally heterogeneous material with constant elastic modulus and Poisson＇s ratio. The cooling rate applied at the FGC surface is modeled using a linear ramp function. An integral equation method and a closed form asymptotic temperature solution are employed to compute the thermal stress intensity factor （TSIF）. The thermal shock residual strength and critical thermal shock of the FGC plate are obtained using the SIF criterion. Thermal shock simulations for an Al2O/Si3N4 FGC indicate that a finite cooling rate leads to a significantly higher critical thermal shock than that under the sudden cooling condition. The residual strength, however, is relatively insensitive to the cooling rate.
This work presents a semi-analytical model to explore the effects of cooling rate on the thermal shock resistance behavior of a functionally graded ceramic （FGC） plate with a periodic array of edge cracks. The FGC is assumed to be a thermally heterogeneous material with constant elastic modulus and Poisson＇s ratio. The cooling rate applied at the FGC surface is modeled using a linear ramp function. An integral equation method and a closed form asymptotic temperature solution are employed to compute the thermal stress intensity factor （TSIF）. The thermal shock residual strength and critical thermal shock of the FGC plate are obtained using the SIF criterion. Thermal shock simulations for an Al2O/Si3N4 FGC indicate that a finite cooling rate leads to a significantly higher critical thermal shock than that under the sudden cooling condition. The residual strength, however, is relatively insensitive to the cooling rate.
