摘要
随着现代科学技术的高速发展,电子仪器正在向小型化、微型化、高集成化方向迈进,导电胶作为一种新兴的绿色环保微电子封装材料,广泛应用于电子产品中。本文介绍了导电胶的组成,从宏观和微观角度对导电机理进行了概述,并对国内外最新成果进行了综述,最后对各向异性导电胶的发展前景作了展望。
With the rapid development of modern science and technology, the electronic instrumentss are marchingtowards the miniaturization,micromation and high integration.The electroconductive adhesives as a emerging green andenvironment friendly microelectonic packaging materials have been widely used in the electronic products.This paperintroduced the composition of conductive adhesives,outlined the electrical conduction mechanism form both macroscopicand microcosmic view,and summarized the latest research results at home and abroad.Finally,the future developmentprospect of the anisotropically conductive adhesives was presented
出处
《粘接》
CAS
2014年第8期66-70,共5页
Adhesion
关键词
导电胶
导电机理
电阻率
接触电阻
conductive adhesive
electrical conduction mechanism
electrical resistivity
contact resistance
