摘要
LED封装材料在封装的过程中由于热膨胀的缘故会产生应力,将对LED的发光效率产生较大影响。改装的迈克尔逊干涉仪用于测量二氧化钛/有机硅复合的LED封装材料在不同温度范围内的热膨胀系数,具有测量准确,分辨率高等优点。
LED packaging material can cause stress due to thermal expansion in the packaging process, will have a greater impact on the luminous efficiency of LED. The modified Michelson interferometer is used to measure the thermal expansion coefficient of composite LED packaging material with TiO2 and organic Si in dif-ferent temperature range expansions;it has the advantages of accurate measurement,high resolution.
出处
《大学物理实验》
2014年第4期3-5,共3页
Physical Experiment of College
基金
南京信息工程大学本科专业重点建设项目(2013002
2014001)
关键词
迈克尔逊干涉仪
热膨胀系数
LED封装材料
Michelson interferometer thermal expansion coefficient LED packaging materials
